The Epoxy fiberglass cloth CCL HC-32F (FR-4), due to it’s excellent electrical properties, heat resistance, mechanical strength and flame retardant, it is widely used in electronic computers, personal computers, computing controller substrates, instrumentation, automotive controller substrates, mobile phone substrates, semiconductor mounting substrates, multilayer circuit boards, etc. In order to comply with the urgent demand of the market for epoxy glass fiber cloth-based copper clad laminate and expand the market share of the company, in 2013, our company adopted the combination of traditional technology and self-innovation to research and develop a new type of HC-32F flame retardant epoxy glass fiber cloth-based copper clad laminate.
On the basis of CEPGC(G)-32F model standard in the GB4724-92, the performance of the products developed by our company can meet the requirements of American IPC4101A standard (American Electronic Circuit Interconnection and Packaging Association standard): heat resistance 288 ℃/50S or more (meeting the requirements of environmental protection lead-free soldering processing); Warpage: ≤ 0.3; CTI index: 300V and UV light blocking performance. The product performance and environmental protection indicators in line with the national standard and the EU ROHS (China Test CTI Report No. RHS05F003803001E), REACH (China Test CTI Report No. RHS05F004088002E) directive requirements and has successfully passed the national CQC product certification (certificate No. CQC13001097748, CQC13001097449).
General Properties:
Test Item | Unit | Test Method (IPC-TM-650) | Test Condition | Specification (IPC-4101C) | Typical Value |
Peel Strength(1oz.) | N/mm | 2.4.8 | 125℃ | -- | 1.65 |
Float288℃/10s | ≥1.05 | 1.60 | |||
Thermal Stress | Sec | 2.4.13.1 | Float288℃/10s | ≥10 | 30 |
Bow/Twist | % | 2.4.22.1 | A | ≤1.0 | 0.4/0.6 |
Flexural Strength | N/mm２ | 2.4.4 | Warp | ≥415 | 545 |
Fill | ≥345 | 400 | |||
Flammability | Rating | UL94 | UL94 | UL94 V-0 | V-0 |
Surface Resistivity | MΩ | 2.5.17.1 | C-96/35/90 | ≥1.0×104 | 1.0×106 |
Volume Resistivity | MΩ－cm | 2.5.17.1 | C-96/35/90 | ≥1.0×106 | 1.0×108 |
Dielectric Constant | ― | 2.5.5.2 | Etched/@1 MHZ | ≤5.4 | 4.5 |
Loss Tangent | ― | 2.5.5.2 | Etched/@1 MHZ | ≤0.035 | 0.024 |
Arc Resistance | Sec | 2.5.1 | D-48/50+D-0.5/23 | ≥60 | 124 |
Moisture Absorption | % | 2.6.2.1 | D-24/23 | ≤0.5 | 0.21 |
Comparative Tranking Index | V | IEC60112 | Etched/0.1%NH4CL | ≥150 | 175/300 |
Glass Transition(Tg) | ℃ | 2.4.25 | E-2/105 DSC | ≥130 | 133 |
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Remarks:Typical values for reference only. Specimen Thickness:1.6mm 1/0
A = Keep the specimen originally without any process
C = Temperature and humidity conditioning
D = Immersing in distilled water with temperature control
E = Temperature conditioning
